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The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator by Crack STM32F103CB Microcontroller Flash Memory. All the information given in this paragraph are based on characterization results obtained with typical external components specified in below Table.

In the application, the resonator and the load capacitors have to be placed as close as possible to the oscillator pins in order to minimize output distortion and startup stabilization time after Unlock MC68HC705C8A MCU Flash Memory. Refer to the crystal resonator manufacturer for more details on the resonator characteristics (frequency, package, accuracy).

For CL1 and CL2 it is recommended to use high-quality ceramic capacitors in the 5 pF to 15 pF range selected to match the requirements of the crystal or resonator when Break IC Flash. CL1 and CL2, are usually the same size in the purpose of Crack NXP P87C552 Microcontroller Flash Memory. The crystal manufacturer typically specifies a load capacitance which is the series combination of CL1 and CL2.

Crack STM32F103CB Microcontroller Flash Memory

Load capacitance CL has the following formula: CL = CL1 x CL2 / (CL1 + CL2) + Cstray where Cstray is the pin capacitance and board or trace PCB-related capacitance to facilitate the process of Break NXP MC908SR12 Microcontroller Flash. Typically, it is between 2 pF and 7 pF.

Caution:      To avoid exceeding the maximum value of CL1 and CL2 (15 pF) it is strongly recommended to use a resonator with a load capacitance CL £ 7 pF. Never use a resonator with a load capacitance of 12.5 pF.

Example: if you choose a resonator with a load capacitance of CL = 6 pF, and Cstray = 2 pF, then CL1 = CL2 = 8 pF.