IC decapsulation — also called decapping, delidding or package opening — removes the mould compound, ceramic lid or metal can from an integrated circuit so that the silicon die, bond wires, metallisation and lead frame become visible and workable. It is the first step in almost every downstream task: failure analysis, die photography, circuit extraction, probe station measurement, or preparing a sample for a destructive physical analysis report.

We operate a dedicated decapsulation bench with three complementary methods and select the process per package rather than per convenience. That distinction matters more than it sounds. The wrong method destroys the evidence you hired someone to recover: hot acid attacks aluminium bond wires, laser energy scorches fine geometries and can crack the die, and plasma alone will not cut through a silica-filled mould compound in a reasonable time.

Our three decapsulation methods

Controlled acid etching

Fuming nitric or sulphuric acid applied at a controlled temperature, with the etch front stopped as soon as the die surface is exposed. This is the default for plastic packages when bond wire integrity must be preserved. We work under an extraction hood with droplet-level control so that the etch stops on the die face instead of underneath it.

Laser decapsulation

A focused laser opens a precise window above the region of interest — typically the metal layer, a specific memory block or a single analog block. Laser is the only practical route when the rest of the package must stay intact, when the device is potted, or when you need an opening smaller than a square millimetre without disturbing neighbouring circuitry.

Plasma ashing

Oxygen plasma removes the epoxy matrix while leaving metal and silicon untouched. Because it is a dry, non-contact process with no liquid chemistry, plasma is the safest option for copper bond wires, for devices with delicate MEMS structures, and for final cleaning after an acid or laser opening.

Packages we routinely open

• Plastic packages: QFN, QFP, LQFP, TQFP, SOP, SOIC, SSOP, TSSOP, DIP, PDIP, SOT-23, SC-70, BGA, LGA, WLCSP, CSP, QFN with exposed pad
• Power and discrete: TO-220, TO-247, TO-263, DPAK, D2PAK, TO-92, TO-3P, IGBT modules
• Hermetic: ceramic DIP and side-brazed packages, ceramic PGA, metal-can (TO-5, TO-8, TO-18, TO-39) with lid removal rather than etching
• Modules and multi-die: SiP, MCM, hybrid modules, power modules, sensor packages

What you receive

• Photographic report of the opened device at overview, mid and die-level magnification
• High-resolution images of the die top metal, addressing decap plan and any defects found
• A note recording which method was used, the etch depth or window geometry, and any artefacts introduced by the process
• The physical sample, returned on request, packed for safe transport

Turnaround and process

Frequently asked questions

Can you decapsulate without damaging the bond wires?
Yes — that is a process choice, not a limitation. For plastic packages we use controlled acid etch with an early etch stop, which leaves aluminium and copper bond wires intact and still attached. If the wires must remain electrically testable afterwards, tell us in the request and we will plan the process around it.

My package is encapsulated in a metal can. Can it still be opened?
Yes. Metal-can and ceramic-lid packages are opened mechanically rather than chemically. We cut or mill the can or lid, lift it, and photograph the cavity before and after removal, so there is no risk to the die from etch chemistry.

How large an opening can you make?
For laser decapsulation the practical minimum is a window a few hundred micrometres across. For a full-package etch we expose the entire die surface. Partial openings that keep most of the package mechanically intact are also possible when a sample has to be re-tested afterwards.

Do you need to know what is inside the package before starting?
No, but it helps. If you already know the die manufacturer or part number, we can adjust the etch chemistry and the opening geometry in advance. If you do not, we start with a trial opening on a spare sample where one is available.

Will the process change the electrical behaviour of my sample?
A decapsulated die can no longer be handled as a packaged part, and the package integrity is gone. The die itself remains electrically functional and can be probed on a probe station in most cases. If your goal is live measurement, say so in the request so that we can plan the opening around your probe card.

Start a decapsulation request

Send us the package type, quantity, and what you need to see afterwards — surface inspection, bond wire check, die photography, or a probe-ready opening. We will confirm the method, the deliverable and the turnaround before any sample is touched. We accept work only where the requester can demonstrate ownership of the device or written authorisation to analyse it.