IC Crack Methods

IC Crack Methods

 

IC crack can be diversify as three different ways like semi-invasive crack IC, un-invasive IC crack, invasive crack IC. And ultra-violet radiation crack IC is the most ancient way of this industry. In the middle of 1970 attacker use this way to IC crack and it has been viewed as the invasive attack, but it need to decapsulate the package of IC, and surely it will classify semi-invasive IC crack. But it works on most of the OTP and UV EPROM microcontrollers. These MCU IC can fend off the low cost and low level IC crack.

Ultra-Violet IC crack can be separated into two steps: the first one is locate the security fuse of IC, and then use ultra-violet radiation to reset the IC to un-protection states. Normally the design of security fuse in the IC later than IC memorizer but ultra-violet radiation can cover the whole IC.

Circuit Engineering Company Limited continues to be recognized as the Southern China Leader in Services for IC crackion service. With the advancement of today’s modern circuit board technology, it is more important than ever to have specialists available to help you at a moment’s notice. Our engineering and commercial teams collectively have a vast amount of electronic experience covering field include Consumer Electronics, Industrial Automation Electronics, Wireless Communication Electronics., etc. For more information please contact us through email.


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