Crack MCU dsP30F5015 Heximal

We can Crack MCU dsP30F5015 Heximal, please view the MCU dsP30F5015 features for your reference:

High-Performance Modified RISC CPU:

· Modified Harvard architecture

· C compiler optimized instruction set architecture with flexible Addressing modes

· 83 base instructions

· 24-bit wide instructions, 16-bit wide data path

· 66 Kbytes on-chip Flash program space (Instruction words) when Crack MCU

· 2 Kbytes of on-chip data RAM

· 1 Kbyte of nonvolatile data EEPROM

· Up to 30 MIPS operation:

– DC to 40 MHz external clock input

– 4 MHz-10 MHz oscillator input with PLL active (4x, 8x, 16x)

· 36 interrupt sources:

– Five external interrupt sources if Crack MCU

– Eight user-selectable priority levels for each interrupt source

– Four processor trap sources

· 16 x 16-bit working register array before Crack MCU

· Enhanced Flash program memory:

– 10,000 erase/write cycle (minimum) for industrial temperature range, 100K (typical)

· Data EEPROM memory:

– 100,000 erase/write cycle (minimum) for industrial temperature range, 1M (typical)

· Self-reprogrammable under software control before Crack MCU

· Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)

· Flexible Watchdog Timer (WDT) with on-chip, low-power RC oscillator for reliable operation

· Fail-Safe Clock Monitor operation detects clock failure and switches to on-chip, low-power RC oscillator

· Programmable code protection

· In-Circuit Serial Programming™ (ICSP™) programming capability after Crack MCU

· Selectable Power Management modes:

– Sleep, Idle and Alternate Clock modes

This document contains device specific information for the dsPIC30F5015/5016 devices. The dsPIC30F devices contain extensive Digital Signal Processor (DSP) functionality within a high-performance 16-bit microcontroller (MCU) architecture if Crack MCU.

Figure 1-1 is a block diagram of the dsPIC30F5015 device. Following the block diagram, Table 1-1 provides a brief description of the device I/O pinout and the functions that are multiplexed to the port pins on the dsPIC30F5015 when Crack MCU.

Figure 1-2 is a block diagram of the dsPIC30F5016 device. Following the block diagram, Table 1-2 provides a brief description of the device I/O pinout and the functions that are multiplexed to the port pins on the dsPIC30F5016 before Crack MCU.


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