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Crack IC flash firmware should start from understand the working principle of it. The first step Is establishing the processor schematic diagram, which can be realized by the optical microprobe with camera to crack the high resolution IC surface diagram.

As for the basic systematic structure, follow the obvious block rim metal wire through learning and understanding the connection drawing such as data bus or address bus can readily identify it;

All the processor block from IC are all connected together through data bus, so it is relative easier to identify the flip-latch and driver. Most of the modern microcontroller and smartcard are made by 0.25 to 0.5 micron technology with 2-4 metal layer. We can crack IC through manual inspection and optical technology to proceed the process but need some special metal layer.

The next generation of microcontroller memory attacking can use more thin track and more metal layer, and require more expensive tool for crack such as scanning electron microscope. And we can use FOCUSED ION BEAM to crack and modify the IC structure. FOCUSED ION BEAM is quite similar to Scanning Electron Microscope but it can cut the metal and silicon interconnection, and rebuild the connection by the submicron preciseness. If we use laser operation platform, can crack IC on the surface blindy.

IC can be abrasive from the opposite side till several dozens of micron. Use laser interferometer or infrared imaging can locate the single unit of transistor, through dig a hole in the bottom layer of silicon can make the connection. This kind of mcu cracking from rear side of microcontroller has been used long time ago which has become quite populated nowadays.

Circuit Engineering Company Limited continues to be recognized as the Southern China Leader in Services for IC Attack, MCU Crack, Chip Extract, Microcontroller Unlock service. With the advancement of today’s modern circuit board technology, it is more important than ever to have specialists available to help you at a moment’s notice. Our engineering and commercial teams collectively have a vast amount of electronic experience covering field include Consumer Electronics, Industrial Automation Electronics, Wireless Communication Electronics., etc. For more information please contact us through email.

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