Crack Chip Security Level

Chip crack are quite used to be the discussion about their security level, so according to the IBM internal file of chip crack, security system of chip can be classified into six levels: from no security method against chip crack till the level of uncrackable chip:

 

ZERO CHIP CRACK level:

There is no special or dedicated security measures for these chips against cracking and each one of its internal system can be visited freely. such as the microcontroller outside ROM and FPGA;

LOW CHIP CRACK level:

Use some security measures but the way to crack it is relatively easier. Such as the soldering iron and low price simulated oscillograph can crack it. It need time but not too much. Such as the internal microcontroller without protection but programming algorithm is private.

MID-LOW CHIP CRACK level

Security measure can fend off most of cheap crack chip method, and need to use more expensive tools and dedicated knowledge to crack them such as the power analysis and power supply noise sensitivity microcontroller;

MID CHIP CRACK level

Need to use special instrument and facilities, and special skill and knowledge. Crack chip will probably consume more time such as prevent the ultra-violet crack microcontroller and old smartcard;

MID HIGH CHIP CRACK level

Attention must be paid to security protection, there is instrument for chip crack but the purchase price is extremely expensive. Special knowledge and knowledge such as the more advanced security protection modern smartcard. Complex ASIC, security FPGA and CPLD;

HIGH CHIP CRACK level

These chip can resist all the already known crack, need a special team to research a new way for cracking the chip. Some of them need to use a separate building and can’t ensure the success rate of job. Only the microcontroller manufacturer or government can establish the laboratory can achieve this such as the encryption model in the application of signature.

 

As we all know, one chip can’t stay at the same security level for too long and their level is always changing which is depends on the way to crack them.

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